樹脂組成物、接着剤、封止材、ダム剤、および半導体装置

Title:

樹脂組成物、接着剤、封止材、ダム剤、および半導体装置

Document Type and Number:

Japanese Patent JP6873489

Kind Code:

B2

Abstract:

Provided is a light- and heat-curable resin composition that has high adhesive strength (especially high peel strength) after curing and that can also suppress reductions in adhesive strength after a post-curing moisture resistance test. The provided resin composition contains (A) an acrylic resin, (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4) (in the formula, R1, R2, R3, and R4 each independently are hydrogen or C3H6SH, and at least one of R1, R2, R3, and R4 is C3H6SH), and (C) a latent curing accelerator.

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Inventors:

Kazuki Iwatani
Arai Fumi

Application Number:

JP2018538432A

Publication Date:

May 19, 2021

Filing Date:

September 06, 2017

Export Citation:

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Assignee:

Namics Co., Ltd.

International Classes:

C08G75/04; C09J4/02; C09J11/06; C09K3/10

Domestic Patent References:

JP4976575B1
JP57105472A
JP5328959B1
JP4136801A

Foreign References:

WO2013005471A1

Attorney, Agent or Firm:

Iat International Patent Business Corporation

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