Title:
半導体用シートの製造方法および製造装置、並びに切り込み刃
Document Type and Number:
Japanese Patent JP6879716
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a sheet for semiconductor capable of sufficiently suppressing waste removal failure.SOLUTION: A method for manufacturing a sheet for semiconductor includes: a step of unwinding a long sheet 100 for semiconductor which has an adhesive layer 3, a first sheet 1 and a second sheet 2, where, when a peeling force from the adhesive layer 3 of the first sheet 1 is represented by Fand a peeling force from the adhesive layer 3 of the second sheet 2 is represented by F, Fis larger than F; a step of performing such half-cutting as to make cuts on the second sheet 2 and the adhesive layer 3 to form a plurality of first cuts 41 provided along a contour shape of a semiconductor wafer in plan view of the sheet 100 for semiconductor and a second cut 42 provided in a longitudinal direction of the sheet 100 for semiconductor on an outside region OR; and a step of removing the adhesive layer 3 in the second sheet 2 and the outside region OR from the sheet 100 for semiconductor while remaining the adhesive layer 3 in the inside region IR on the first sheet 1.SELECTED DRAWING: Figure 5
Inventors:
Kanai Michio
Osamu Yamazaki
Osamu Yamazaki
Application Number:
JP2016224223A
Publication Date:
June 02, 2021
Filing Date:
November 17, 2016
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/00; B26D3/08; B26F1/00; B26F1/44; H01L21/301
Domestic Patent References:
| JP2014094995A | ||||
| JP50155200A | ||||
| JP7041736A | ||||
| JP2011114271A | ||||
| JP2004079743A |
Attorney, Agent or Firm:
Intellectual Property Office