Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP6881552
Kind Code:
B2
Abstract:
To provide a resin composition capable of providing an insulation layer excellent all in circuit embedding properties, dielectric loss tangent, and breaking point elongation in manufacturing a printed wiring board and an adhesive film, the printed wiring board and a semiconductor device using the same.SOLUTION: There is provided a resin composition containing (A) an epoxy resin, (B) an active ester compound and (C) triphenylimidazole which may have a substituent.SELECTED DRAWING: None
Inventors:
Shohei Fujishima
Shigeo Nakamura
Shigeo Nakamura
Application Number:
JP2019205806A
Publication Date:
June 02, 2021
Filing Date:
November 13, 2019
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; C08K3/36; C08K5/10; C08K5/3445; C08L101/00; C09J7/35; C09J11/04; C09J11/06; C09J163/00; H05K1/03
Domestic Patent References:
| JP2015230901A | ||||
| JP2013082873A | ||||
| JP2013185089A | ||||
| JP2014185222A | ||||
| JP2014185221A | ||||
| JP2013060553A |
Foreign References:
| WO2011132674A1 |
Attorney, Agent or Firm:
Sakai International Patent Office