Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6883462
Kind Code:
B2
Abstract:
The invention provides a substrate processing device. A liquid processing unit (U1) of the substrate processing apparatus includes: a rotary chuck (61) that holds a wafer (W); a rotation drive unit (64) that rotates the rotary chuck (61); a coating liquid supply nozzle (62) that supplies a coating liquid to the wafer (W) held by the rotary chuck (61) that is driven by the rotary drive unit (64) torotate; a cup base (65) that collects a coating liquid falling from a back surface (W2), which is the surface of the wafer (W) on the opposite side from the surface (surface W1) to which the coatingliquid is supplied; and a collection plate (30) that is disposed between the back surface (W2) and the cup base (65) and that collects a line generated by supplying a coating liquid to the rotating wafer (W). As a result, it is possible to suppress the deposition of threads generated when a processing liquid is supplied to a rotating substrate in the recovery unit.
Inventors:
Tetsuji Miyamoto
Hirokazu Inada
Hirokazu Inada
Application Number:
JP2017078260A
Publication Date:
June 09, 2021
Filing Date:
April 11, 2017
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; B05C11/08; G03F7/16
Domestic Patent References:
| JP2013243317A | ||||
| JP3175893U | ||||
| JP2006086204A | ||||
| JP53025267U | ||||
| JP54103164U | ||||
| JP1140628A |
Foreign References:
| US20060013953 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Yasushi Naito
Yoshiki Kuroki
Junji Kashiwaoka
Yasushi Naito