Title:
半導体装置の製造方法および半導体装置の製造装置
Document Type and Number:
Japanese Patent JP6885278
Kind Code:
B2
Abstract:
To provide a semiconductor device manufacturing method and a semiconductor device manufacturing apparatus, capable of accurately detecting positional deviation of a lead frame, with a simple configuration.SOLUTION: The semiconductor device manufacturing method includes: transporting a semiconductor device in a predetermined direction by moving a feed pin in a state in which the feed pin is inserted into a hole; inserting a first positional deviation detection pin for detecting positional deviation of the semiconductor device into a first hole of a plurality of holes; inserting a fixation pin having a distance from its tip to a lead frame longer than that of the first positional deviation detection pin into a second hole of the plurality of holes that is disposed at a position close to the semiconductor device; inserting a second positional deviation detection pin that has a distance from its tip to the lead frame longer than that of the first positional deviation detection pin and that of the fixation pin and is for detecting the positional deviation of the semiconductor device into a third hole of the plurality of holes that differs from the first hole and the second hole; and detecting the existence of positional deviation of the semiconductor device transported to a predetermined position depending on whether or not the first positional deviation detection pin and the second positional deviation detection pin are inserted into the holes.SELECTED DRAWING: Figure 8
Inventors:
Yoshio Nishimura
Application Number:
JP2017182411A
Publication Date:
June 09, 2021
Filing Date:
September 22, 2017
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L21/50; H01L21/52; H01L21/60
Domestic Patent References:
| JP4253527A | ||||
| JP2007184514A | ||||
| JP10223658A | ||||
| JP2007142086A | ||||
| JP3214744A |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation