Title:
テストシステム
Document Type and Number:
Japanese Patent JP6885456
Kind Code:
B2
Abstract:
A test system configured to perform an electrical-characteristic test on a device under test, includes: a mount on which the device under test is to be mounted; a conveyance mechanism configured to convey the mount; a test head including a measurement circuit for performing the electrical-characteristic test; a probe configured to connect an electrode of the device under test to the measurement circuit; a lifting and lowering mechanism configured to move the mount along a first direction such that the electrode and the probe are in contact or spaced apart; and an alignment mechanism provided at the test head, the alignment mechanism being configured to move the probe on a plane crossing the first direction so as to align the probe with the electrode on the plane.
Inventors:
Takayuki Hamada
Yoichi Sakamoto
Yoichi Sakamoto
Application Number:
JP2019501079A
Publication Date:
June 16, 2021
Filing Date:
December 19, 2017
Export Citation:
Assignee:
Shinto Industry Co., Ltd.
International Classes:
G01R31/26; G01R31/28; H01L21/66
Domestic Patent References:
| JP2568104B2 | ||||
| JP2016206150A | ||||
| JP2007095993A | ||||
| JP61015341A | ||||
| JP3041466Y2 |
Foreign References:
| US20100271062 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Omori Tetsuhei
Atsushi Umekage
Yoshiki Kuroki
Omori Tetsuhei
Atsushi Umekage