Title:
金属膜付き脆性材料基板の分断方法並びに分断装置
Document Type and Number:
Japanese Patent JP6888809
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting method and a cutting device capable of cutting a brittle material substrate provided with a metal film cleanly with a simple process.SOLUTION: A laser beam L1 including burst of a pulse laser beam is transmitted through an aberration generating lens 4c that generates aberration to generate an aberration laser beam L2, a most focused portion of the aberration laser beam L2 is scanned along a scheduled cutting line from the surface of a brittle material substrate W1 that is a base of a metal film equipped-brittle material substrate W, at the same time as forming a modified layer K having reduced strength on the brittle material substrate W1, a dividing groove V is formed in a metal film W2, and then, along with the modified layer K, the metal film-equipped brittle material substrate W is divided along the scheduled cutting line via breaking means.SELECTED DRAWING: Figure 5
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Inventors:
Hiroyoshi Hayashi
Application Number:
JP2017068795A
Publication Date:
June 16, 2021
Filing Date:
March 30, 2017
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
H01L21/301; B23K26/064; B23K26/364; B23K26/53; C03B33/09
Domestic Patent References:
| JP2012076093A | ||||
| JP2010201479A | ||||
| JP2015129076A | ||||
| JP2008098465A | ||||
| JP2016068392A | ||||
| JP2013136077A | ||||
| JP2002110588A |
Foreign References:
| WO2016114934A1 |
Attorney, Agent or Firm:
Yoshio Kashima