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Patent Searching and Data


Title:
発光デバイス
Document Type and Number:
Japanese Patent JP6890952
Kind Code:
B2
Abstract:
A light emitting device comprises: a semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer positioned between the first semiconductor layer and the second semiconductor layer; a first bonding pad positioned on the semiconductor stack; a second bonding pad positioned on the semiconductor stack, spaced apart from the first bonding pad, and defining an area located between the first bonding pad and the second bonding pad on the semiconductor stack; and a plurality of holes passing through the active layer to expose the first semiconductor layer. On a plan view of the light emitting device, the first bonding pad and the second bonding pad are formed in areas other than the plurality of holes.

Inventors:
Chen, Chao-sin
One, Jia Quen
Chuang, Wen-Hun
Zhen, Zhu Yao
Le, Chen-Lin
Shu, Chi-Cyan
Chiang, Tsun-Shun
Huh, bogeun
Lee, Quang-Yee
Lynn, Yulin
Shen, Qianfu
Ko, tun-kai
Application Number:
JP2016220737A
Publication Date:
June 18, 2021
Filing Date:
November 11, 2016
Export Citation:
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Assignee:
Epistar Corporation
International Classes:
H01L33/38; H01L21/28; H01L21/3205; H01L21/768; H01L23/522; H01L33/40; H01L33/44
Domestic Patent References:
JP2013247298A
JP2014022608A
JP2009238931A
Foreign References:
US20150171298
CN204315621U
WO2011068161A1
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki