Title:
ＩＣモジュール、ＩＣカード、およびそれらの製造方法
Document Type and Number:
Japanese Patent JP6897318
Kind Code:
B2
Abstract:
To provide an IC card which has high reliability, high productivity, high cost superiority, and excellent appearance by using solder capable of connecting an IC module and an antenna with higher strength.SOLUTION: An IC module comprises a substrate (11) having a conductive foil (13) on only one face. The conductive foil forms an external connection terminal (2) used for contact type communication, and a bridge circuit (3) which electrically connects the IC chip and an antenna for contactless communication. The substrate has a through hole (4). A first construction (15) is formed at the through hole from the rear face of the bridge circuit. A second construction (16) different from the first construction is formed at a face of the first construction opposite to the bridge circuit. A melting point of the second construction is lower than the melting point of the first construction.SELECTED DRAWING: Figure 1
Inventors:
Tetsuya Tsukada
Application Number:
JP2017104441A
Publication Date:
June 30, 2021
Filing Date:
May 26, 2017
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
G06K19/077
Domestic Patent References:
| JP2001084350A | ||||
| JP2015008254A | ||||
| JP8204322A | ||||
| JP2010062256A | ||||
| JP2001109865A | ||||
| JP2014115938A | ||||
| JP2000323649A |
Foreign References:
| US20040201096 | ||||
| WO2008050689A1 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Shiro Suzuki
Yuichiro Shimizu
Makiko Otsuki
Masatake Shiga
Tadashi Takahashi
Shunsuke Fushimi
Shiro Suzuki
Yuichiro Shimizu
Makiko Otsuki
Masatake Shiga
Tadashi Takahashi
Shunsuke Fushimi