Title:
保護フィルム
Document Type and Number:
Japanese Patent JP6897809
Kind Code:
B2
Abstract:
To provide protective films characterized in that, when the protective films respectively pasted on both the sides of a resin substrate are peeled after thermal bending, gripping margins in which a part of the protective films is projected from the edge parts of the resin substrate to the surface direction of the resin substrate are formed, also, a phenomenon that the gripping margins projected from both the sides are joined each other is prevented, and the peeling of the protective films with the gripping margins as the starting point can be smoothly performed without requiring time or trouble.SOLUTION: Protective films are each used when a resin substrate is subjected to thermal bending, and comprise: a base material layer; and an adhesive layer adhered to the resin substrate. The base material layer includes: a first layer located at the side opposite to the adhesive layer and having a melting point of 150°C or higher; and a second layer located at the side of the adhesive layer and having a melting point of below 150°C, the adhesive layer has a melting point of below 150°C, and a thermoplastic resin included in the second layer has an MFR of 0.5 to 4.0 g/10 min in reference to the JISK7210.SELECTED DRAWING: Figure 1
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Inventors:
Inaba Taisei
Onodera Wabo
Onodera Wabo
Application Number:
JP2020012001A
Publication Date:
July 07, 2021
Filing Date:
January 28, 2020
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B32B27/00; B29C53/04; B32B27/32
Foreign References:
| WO2014189078A1 | ||||
| WO2016080445A1 |
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi