Title:
研磨方法および研磨装置
Document Type and Number:
Japanese Patent JP6899298
Kind Code:
B2
Abstract:
To provide a polishing method and a polishing device capable of efficiently polishing a substrate while maintaining a polishing load in a proper range.SOLUTION: This method presses a polishing tape 7 to a wafer W by a polishing head 11 by adding force generated by an air cylinder 25 to the polishing head 11, and a stopper 35 is moved in the prescribed direction by a stopper movement mechanism 37 while limiting the movement in the prescribed direction of a positioning member 31 connected to the polishing head 11 by the stopper 35, and an inclination amount of the stopper 35 when receiving a load from the positioning member 31 is determined, and the load is determined from the inclination amount of the stopper 35, and a polishing load of the polishing tape 7 added to the wafer W is determined by subtracting the determined load from a value of force generated by the air cylinder 25, and the wafer W is polished while moving the stopper 35 at a determined travel speed by determining the travel speed of the stopper 35 capable of restraining the polishing load within a target range.SELECTED DRAWING: Figure 4
Inventors:
Atsushi Yoshida
Yamashita Michiyoshi
Yamashita Michiyoshi
Application Number:
JP2017185751A
Publication Date:
July 07, 2021
Filing Date:
September 27, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B47/26; B24B7/04; H01L21/304
Domestic Patent References:
| JP2017185612A | ||||
| JP2014150131A | ||||
| JP2013103318A | ||||
| JP2011079079A |
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Isamu Watanabe