Title:
伝導性組成物用バインダーとしてのポリマーエマルション
Document Type and Number:
Japanese Patent JP6901486
Kind Code:
B2
Abstract:
Provided herein are metal conductive compositions with improved conductivity. The improved conductivity is attributable to the addition of a sintering agent and a polymer emulsion.
Inventors:
Chan, Wenhwa
Juu, Ching Yen
Woods, John Gee.
Jean, Hong
Woo, Jun Jun
Jason, Mark
Juu, Ching Yen
Woods, John Gee.
Jean, Hong
Woo, Jun Jun
Jason, Mark
Application Number:
JP2018533234A
Publication Date:
July 14, 2021
Filing Date:
December 20, 2016
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
H01B1/22; C08L101/00; H01B13/00; B22F1/052; B22F1/0545; B22F1/10
Domestic Patent References:
| JP63268774A |
Attorney, Agent or Firm:
Katsuhiro Ito