Title:
無線通信モジュール
Document Type and Number:
Japanese Patent JP6905438
Kind Code:
B2
Abstract:
To provide a wireless communication module capable of preventing radiation characteristics from being changed by deformation of an antenna circuit board, a wireless communication module (1) includes an antenna circuit board (11) having a first principal surface (1111) on which at least one antenna element (114_j) is mounted and a second principal surface (1112) on which an integrated circuit (115) is mounted. The wireless communication module (1) includes a support (12) that holds the antenna circuit board (11) by being in contact with a pair of opposite sides thereof and that thereby keeps the antenna circuit board (11) flat. The support (12) either (i) faces the second principal surface (1112) and is separated from the second principal surface (1112) by a distance that is not smaller than the wavelength of an electromagnetic wave transmitted and received with use of the antenna circuit board (11) or (ii) does not face the second principal surface (1112).
Inventors:
Kohei Matsumaru
Application Number:
JP2017182770A
Publication Date:
July 21, 2021
Filing Date:
September 22, 2017
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
H01Q23/00; H01Q1/38
Domestic Patent References:
| JP2012514431A | ||||
| JP2008244581A | ||||
| JP2008252303A | ||||
| JP2004140632A | ||||
| JP11136024A | ||||
| JP2005086603A | ||||
| JP2002076720A | ||||
| JP2004048489A | ||||
| JP2003500832A | ||||
| JP200168576A | ||||
| JP2003133801A | ||||
| JP2002329833A |
Foreign References:
| WO2014196144A1 | ||||
| FR2710195A1 | ||||
| US8061012 | ||||
| WO2016031807A1 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark