Title:
積層構造体及びその作製方法
Document Type and Number:
Japanese Patent JP6905722
Kind Code:
B2
Abstract:
A layered structure having high adhesive properties, and high hardness or excellent transparency, is prepared on a base material such as a resin. A layered structure including: an organic-inorganic hybrid member containing a primary inorganic particle and an organic polymer covalently bound to each other, wherein the primary inorganic particle forms a network containing the polymer; and a particle aggregate layer containing a secondary particle which is deposited on the organic-inorganic hybrid member and is composed of an inorganic material or a metallic material; wherein in the organic-inorganic hybrid member, the primary inorganic particle and the secondary particle have different crystal particle sizes.
Inventors:
Jun Akiwatari
Hiroaki Noda
Hiroki Tsuda
Nobuo Sakamoto
Hiroaki Noda
Hiroki Tsuda
Nobuo Sakamoto
Application Number:
JP2018518313A
Publication Date:
July 21, 2021
Filing Date:
May 16, 2017
Export Citation:
Assignee:
National Institute of Advanced Industrial Science and Technology
International Classes:
B32B9/00; B32B27/18
Domestic Patent References:
| JP2010036470A | ||||
| JP2015101042A | ||||
| JP2001003180A | ||||
| JP2014049245A |
Foreign References:
| US20150228870 |
Attorney, Agent or Firm:
Hidewa Patent Office