Title:
ボンディングヘッド
Document Type and Number:
Japanese Patent JP6905778
Kind Code:
B2
Abstract:
This bonding head comprises: a base (11) that moves in a vertical direction; an arm (20) that is attached to the base (11) such that it can rotate freely around a rotary shaft (13), a collet (21) being attached to one end of the arm; a spring (19) with an initial tensile force that is attached between the base (11) and the other end of the arm (20); a stopper portion (18) that restricts rotation of the arm (20) against the tensile force of the spring (19); and a load sensor (25) that detects an upward contact load applied to the collet (21). The load sensor (25) detects the contact load only when the rotation of the arm (20) is restricted by the stopper portion (18).
Inventors:
Toru Maeda
Shin Takayama
Shin Takayama
Application Number:
JP2020535813A
Publication Date:
July 21, 2021
Filing Date:
August 06, 2019
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/52; H01L21/60
Domestic Patent References:
| JP6085842U | ||||
| JP4133337A |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office