Title:
銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
Document Type and Number:
Japanese Patent JP6908173
Kind Code:
B2
Abstract:
This copper/ceramic bonded body (10) is obtained by bonding copper members (12, 13) that are formed of copper or a copper alloy and a ceramic member (11) that is formed of a nitrogen-containing ceramic; an active metal nitride layer (41), which contains a nitride of one or more active metals that are selected from among Ti, Zr, Nb and Hf, is formed on the ceramic member (11) side between the copper members (12, 13) and the ceramic member (11); an Mg solid solution layer (45), wherein Mg is solid-solved in a matrix of Cu, is formed between the active metal nitride layer (41) and the copper members (12, 13); and Cu-containing particles (42), which are composed of either or both of Cu particles and compound particles of Cu and an active metal, are dispersed within the active metal nitride layer (41).
Inventors:
Temple Saki Nobuyuki
Application Number:
JP2020194519A
Publication Date:
July 21, 2021
Filing Date:
November 24, 2020
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
C04B37/02; H05K1/03
Domestic Patent References:
| JP201491673A | ||||
| JP2013211546A | ||||
| JP2003192463A |
Foreign References:
| WO2018159590A1 | ||||
| WO2019146464A1 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami