Title:
樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
Document Type and Number:
Japanese Patent JP6911806
Kind Code:
B2
Abstract:
The present invention aims to provide a resin composition having a low dielectric loss tangent and good plating adhesion and base adhesion. The solution of the present invention is a resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a resin having a radical polymerizable unsaturated group, and (D) an aliphatic phosphine compound, wherein the aliphatic phosphine compound has 1 to 4 phosphor atoms directly bonded to aliphatic carbon atoms in each molecule, and 1 to 20 aliphatic carbon atoms in each molecule.
Inventors:
Nagashima Masaki
Application Number:
JP2018064994A
Publication Date:
July 28, 2021
Filing Date:
March 29, 2018
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; B32B27/26; B32B27/38; C08K3/32; C08L101/02; H05K1/03; H05K3/46
Domestic Patent References:
| JP2008291145A | ||||
| JP2008133329A | ||||
| JP11181236A | ||||
| JP11263826A | ||||
| JP2017048400A |
Attorney, Agent or Firm:
Sakai International Patent Office