Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6914050
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the pollution in a device owing to dummy dispensed process liquid.SOLUTION: A substrate processing device according to an embodiment comprises: a holding part; a nozzle; a nozzle bath; and a moving mechanism . The holding part serves to hold a substrate. The nozzle is arranged to emit a process liquid toward the substrate held by the holding part from above the substrate. The nozzle bath is disposed at a retreat position to which the nozzle is retrieved from above the substrate. The nozzle bath receives the process liquid emitted from the nozzle retrieved to the retreat position, and discharges the process liquid to outside. The moving mechanism horizontally moves the nozzle between a processing position and the retreat position over the substrate. In addition, the nozzle emits the process liquid toward the nozzle bath from a position of the same height as that of the nozzle when it is moved horizontally. The nozzle bath has a side wall and a cleaning liquid-supplying part. The side wall extends to a position higher than the height of a process liquid discharge port of the nozzle which is retrieved to the retreat position. The cleaning liquid-supplying part serves to supply the cleaning liquid to the side wall.SELECTED DRAWING: Figure 5
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Inventors:
Yoshiken Ikeda
Ryo Kobayakawa
Hiroki Taniguchi
Kazuyoshi Shinohara
Ryo Kobayakawa
Hiroki Taniguchi
Kazuyoshi Shinohara
Application Number:
JP2017025796A
Publication Date:
August 04, 2021
Filing Date:
February 15, 2017
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304
Domestic Patent References:
| JP2007266553A | ||||
| JP2015006652A | ||||
| JP2007287790A | ||||
| JP62101230U | ||||
| JP2015230957A | ||||
| JP2004233307A |
Foreign References:
| WO2007132609A1 |
Attorney, Agent or Firm:
Sakai International Patent Office