Title:
成形用包装材、蓄電デバイス用外装ケース及び蓄電デバイス
Document Type and Number:
Japanese Patent JP6917255
Kind Code:
B2
Abstract:
To provide a packaging material for molding that can ensure excellent slipperiness when the packaging material for molding is molded, to ensure excellent moldability, and prevents white powder from appearing on the surface of the packaging material.SOLUTION: The packaging material for molding has a substrate layer 2 as an outside layer, a thermally fusible resin layer 3 as an inside layer, and a metal foil layer 4 disposed between both layers. The thermally fusible resin layer 3 is composed of a single layer or a plurality of layers. An innermost layer 7 of the thermally fusible resin layer 3 is composed of a resin composition containing a thermally fusible resin, a roughened material, a slip agent and a fluorine polymer lubricant. The roughened material contains a thermoplastic resin. On the inside surface 7a of the innermost layer 7, formed is a first lubricity layer 11 containing 50 mass% or more of the fluorine polymer lubricant.SELECTED DRAWING: Figure 1
Inventors:
Kenji Yoshino
Makoto Karatsu
Takashi Nagaoka
Makoto Karatsu
Takashi Nagaoka
Application Number:
JP2017180007A
Publication Date:
August 11, 2021
Filing Date:
September 20, 2017
Export Citation:
Assignee:
Showa Denko Packaging Co., Ltd.
International Classes:
B32B15/08; B65D65/40; H01G11/78; H01M50/126
Domestic Patent References:
| JP2013149397A | ||||
| JP2015033828A | ||||
| JP2014022080A | ||||
| JP2004327044A | ||||
| JP2005032456A | ||||
| JP2002050325A | ||||
| JP2018073649A |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Ken Takada
Kenbun Sugiura
Hisayoshi Shimizu
Ken Takada
Kenbun Sugiura