Title:
カメラモジュールおよびその製造方法、並びに電子機器
Document Type and Number:
Japanese Patent JP6918409
Kind Code:
B2
Abstract:
There is provided a camera module including: a stacked lens structure including a plurality of substrates with lenses, the plurality of substrates with lenses being respectively provided with a first through-hole and a second through-hole having different opening widths, and being stacked and bonded to each other by direct bonding, at least the first through-hole of the first through-hole and the second through-hole including a lens disposed therein; and a light receiving element including a plurality of light receiving portions configured to receive light entering through a plurality of first optical units each including the lenses stacked in an optical axis direction in such a manner that the plurality of substrates with lenses are stacked and bonded to each other by direct bonding, the plurality of first optical units arranged at a first pitch, the plurality of light receiving portions being provided corresponding to the plurality of first optical units.
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Inventors:
Atsushi Yamamoto
Application Number:
JP2017011990A
Publication Date:
August 11, 2021
Filing Date:
January 26, 2017
Export Citation:
Assignee:
Sony Semiconductor Solutions Corporation
International Classes:
G02B7/02; G02B3/00; G02B5/20; G03B11/00; G03B15/00; G03B15/02; G03B15/03; G03B17/02; G03B19/07; G03B30/00; H04N5/225
Domestic Patent References:
| JP2015181214A |
Foreign References:
| US20160124196 |
Attorney, Agent or Firm:
Takashi Nishikawa
Yoshio Inamoto
Yusuke Miura
Yoshio Inamoto
Yusuke Miura