Title:
ポジ型感光性樹脂組成物、パターン硬化膜の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
Document Type and Number:
Japanese Patent JP6919746
Kind Code:
B2
Abstract:
A positive photosensitive resin composition which contains (a) an alkali-soluble resin, (b) an onium salt which generates an acid by means of i-beam exposure, (c) a solvent and (d) a crosslinking agent, and wherein the total mass of the components (a), (b) and (d) relative to the total mass of the positive photosensitive resin composition excluding (c) the solvent is 88% by mass or more.
Inventors:
Daisaku Matsukawa
Tetsuya Enomoto
Akitoshi Tanimoto
Atsutaro Yoshizawa
Tetsuya Enomoto
Akitoshi Tanimoto
Atsutaro Yoshizawa
Application Number:
JP2020081736A
Publication Date:
August 18, 2021
Filing Date:
May 07, 2020
Export Citation:
Assignee:
hd micro systems inc.
International Classes:
G03F7/004; G03F7/20; G03F7/40
Domestic Patent References:
| JP2011512552A | ||||
| JP2009505157A |
Attorney, Agent or Firm:
Heiwa International Patent Office