Title:
フレキシブルプリント回路基板の製造方法、およびそれにより製造されたフレキシブルプリント回路基板
Document Type and Number:
Japanese Patent JP6920422
Kind Code:
B2
Abstract:
Disclosed is a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured thereby, which minimizes a dielectric loss due to a high frequency signal and preventing a loss of the high frequency signal. The disclosed method for manufacturing the flexible printed circuit board according to an embodiment of the present disclosure includes preparing a base sheet; preparing a bonding sheet having a melting temperature lower than a melting temperature of the base sheet; forming a laminate by stacking the base sheet and the bonding sheet; and bonding by heating and pressurizing the laminate.
Inventors:
Dan, Songbek
Application Number:
JP2019511862A
Publication Date:
August 18, 2021
Filing Date:
August 29, 2017
Export Citation:
Assignee:
AMOSENSE CO., LTD.
International Classes:
H05K3/46
Domestic Patent References:
| JP2005072187A | ||||
| JP8097565A |
Foreign References:
| WO2014192494A1 | ||||
| WO2009081518A1 | ||||
| WO2000057469A1 |
Attorney, Agent or Firm:
Kyosei International Patent Office