Title:
エポキシ化合物、これを含む硬化性組成物および硬化性組成物を硬化させた硬化物
Document Type and Number:
Japanese Patent JP6921627
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy compound capable of remarkably improving heat resistance of a cured product.SOLUTION: The monoepoxy compound is a monoepoxy compound containing a stereoisomer of a compound represented by formula (1), where a ratio of a peak area derived from the stereoisomer in which a bridgehead position of a norbornane skeleton in formula (1) and a vinyl group are in a trance relationship to the total peak area at a shift value of 140 to 145 ppm is 66% or more. In formula, Rand Rare each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group.SELECTED DRAWING: None
Inventors:
Shohei Takada
Ryuichi Ueno
Soji Koji
Atsushi Kameyama
Ryuichi Ueno
Soji Koji
Atsushi Kameyama
Application Number:
JP2017102922A
Publication Date:
August 18, 2021
Filing Date:
May 24, 2017
Export Citation:
Assignee:
eneos corporation
International Classes:
C08G59/20
Domestic Patent References:
| JP6644659B2 | ||||
| JP6691855B2 | ||||
| JP6649659B2 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura