Title:
研削盤
Document Type and Number:
Japanese Patent JP6924992
Kind Code:
B2
Abstract:
To provide a grinder that can grasp a wear state of a grind stone in an in-process.SOLUTION: A grinder 1 includes: a grinder body 10 for grinding a work W with a grinding wheel K while supplying grinding oil O thereto; a flow passage D through which the grinding oil O containing cutting chips of the work W which is generated by grinding flows; a magnetic field applying part (cutting chip coagulator 11) for applying a magnetic field so as to cross with a direction in which the flow passage D extends; and a detection device 12 for acquiring a parameter relating to a cutting chip coagulation body that is formed by the magnetic field.SELECTED DRAWING: Figure 1
Inventors:
Tomoyuki Shimowaki
Kohei Fujii
Fukui
Hiroyuki Karasawa
Kohei Fujii
Fukui
Hiroyuki Karasawa
Application Number:
JP2017167824A
Publication Date:
August 25, 2021
Filing Date:
August 31, 2017
Export Citation:
Assignee:
Mitsubishi Heavy Industries Machine Tool Co., Ltd.
National University Corporation Tokyo University
National University Corporation Tokyo University
International Classes:
B24B49/18; B23Q17/24; B24B49/10; B24B49/12; B24B53/00
Domestic Patent References:
| JP2011011205A | ||||
| JP2000107984A | ||||
| JP2009028876A | ||||
| JP2002066374A | ||||
| JP49130765A | ||||
| JP11267954A |
Foreign References:
| DE2314602A1 | ||||
| US5331769 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Eisuke Ito
Hiroyuki Hashimoto
Satoshi Koto
Koichiro Kamata
Taichi Hasegawa
Eisuke Ito
Hiroyuki Hashimoto
Satoshi Koto
Koichiro Kamata
Taichi Hasegawa