Title:
電子部品内蔵構造体及び電子部品内蔵構造体の製造方法
Document Type and Number:
Japanese Patent JP6926983
Kind Code:
B2
Abstract:
To provide an electronic component built-in structure capable of reducing the impact of heat of external electronic component on the electronic component, and to provide a manufacturing method of an electronic component built-in structure.SOLUTION: In an electronic component built-in structure 1, when heat is generated in an external electronic component 50, that heat is transmitted in the order of a second electrode terminal 44, an electronic component 10, and a first electrode terminal 42, and since the heat conductivity of a material composing a second electrode layer 12 located on the second principal surface 1b side is lower than the heat conductivity of a material composing a first electrode layer 11 located on the first principal surface 1a side, heat transmission in the first electrode layer 11 is faster than heat transmission in the second electrode layer 12. Furthermore, since the second electrode layer 12 is composed of a material of relatively low heat conductivity, rapid conduction of the heat generated in the external electronic component 50 to the electronic component 10 is restrained. Consequently, impact of the heat of the external electronic component 50 on the electronic component 10 can be reduced.SELECTED DRAWING: Figure 1
Inventors:
Takaaki Morita
Kenichi Yoshida
Mitsuhiro Tomikawa
Kenichi Yoshida
Mitsuhiro Tomikawa
Application Number:
JP2017223039A
Publication Date:
August 25, 2021
Filing Date:
November 20, 2017
Export Citation:
Assignee:
tdk Corporation
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2008227177A | ||||
| JP2011040499A | ||||
| JP2015198212A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami
Yoshiki Kuroki
Takashi Mikami