Title:
基板処理システム及び基板処理方法
Document Type and Number:
Japanese Patent JP6934563
Kind Code:
B2
Abstract:
A substrate processing system includes: a modification layer forming device configured to form a modification layer within a first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate; an interface processing device configured to process an interface where the first substrate and a second substrate are bonded in the peripheral portion; a periphery removing device configured to remove the peripheral portion starting from the modification layer; a position detection device configured to detect a position of the modification layer or a position of the interface; and a control device configured to control the modification layer forming device and the interface processing device. The control device controls the position of the interface based on the detected position of the modification layer, or controls the position of the modification layer based on the detected position of the interface.
Inventors:
Tanoue Hayato
Application Number:
JP2020516241A
Publication Date:
September 15, 2021
Filing Date:
April 15, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304
Domestic Patent References:
| JP11251277A | ||||
| JP201843340A | ||||
| JP2015138951A |
Attorney, Agent or Firm:
Tetsuo Kanamoto
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine