Title:
ダイレクトダイオードレーザ加工装置及びこれを用いた板金の加工方法
Document Type and Number:
Japanese Patent JP6937865
Kind Code:
B2
Abstract:
To provide a direct diode laser processing device that can cut a work-piece with high quality at high speed.SOLUTION: The direct diode laser processing device comprises: a laser oscillator that oscillates laser light with multiple wavelengths; a transmitting fiber that transmits the laser light with multiple wavelengths oscillated by the laser oscillator; and a laser processor that condenses the laser light with multiple wavelengths transmitted by the transmitting fiber so as to process a work-piece, which performs control so that the wavelengths of the laser light with multiple wavelengths are set to less than 1000 nm, beam parameter products of the laser light with multiple wavelengths are set to 4 mm*mrad-25 mm*mrad and cutting speed of the work-piece is set to 0.1 m/min-60 m/min on the basis of a thickness and a rate of absorption of the work-piece.SELECTED DRAWING: Figure 1
Inventors:
Hiroshi Sako
Hiroaki Ishiguro
Hiroaki Ishiguro
Application Number:
JP2020073399A
Publication Date:
September 22, 2021
Filing Date:
April 16, 2020
Export Citation:
Assignee:
Amada Co., Ltd.
International Classes:
B23K26/38; B23K26/064; B23K26/142
Domestic Patent References:
| JP2006263771A | ||||
| JP2012501855A | ||||
| JP780672A | ||||
| JP6076296A |
Foreign References:
| WO2010137475A1 | ||||
| WO2012053045A1 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu