Title:
樹脂組成物およびその製造方法
Document Type and Number:
Japanese Patent JP6946578
Kind Code:
B2
Abstract:
A resin composition obtained by melting a resin mixture containing (A) a polymaleimide compound, (B) a benzoxazine, (C) an epoxy resin, and (D) a coumarone resin, wherein the resin composition contains 40-70 mass parts of the (A) polymaleimide compound per 100 mass parts of the resin component of the resin mixture, has high heat resistance and low dielectric properties (low relative permittivity, low dielectric loss tangent), and can be used as an electrical/electronic component such as a laminated board, printed wiring board, adhesive, sealant, coating, and molded article.
Inventors:
Tatsuya Kawasaki
Shigenobu Kikuchi
Shigenobu Kikuchi
Application Number:
JP2020570347A
Publication Date:
October 06, 2021
Filing Date:
March 05, 2019
Export Citation:
Assignee:
Printec Co., Ltd.
International Classes:
C08G59/56; C09J11/06; C09J145/02; C09J163/00; C09J201/02; H01L23/14; H05K1/03
Domestic Patent References:
| JP2017165922A |
Attorney, Agent or Firm:
Katsuyuki Okubo
Ichiro Kaneko
Ichiro Kaneko