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Title:
ハイブリッドメモリキューブシステム相互接続ディレクトリベースキャッシュコヒーレンス方法
Document Type and Number:
Japanese Patent JP6953488
Kind Code:
B2
Abstract:
A system includes a plurality of host processors and a plurality of hybrid memory cube (HMC) devices configured as a distributed shared memory for the host processors. An HMC device includes a plurality of integrated circuit memory die including at least a first memory die arranged on top of a second memory die, and at least a portion of the memory of the memory die is mapped to include at least a portion of a memory coherence directory; and a logic base die including at least one memory controller configured to manage three-dimensional (3D) access to memory of the plurality of memory die by at least one second device, and logic circuitry configured to implement a memory coherence protocol for data stored in the memory of the plurality of memory die.

Inventors:
Radel, John Dee.
Murphy, Richard Sea.
Application Number:
JP2019168477A
Publication Date:
October 27, 2021
Filing Date:
September 17, 2019
Export Citation:
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Assignee:
Micron Technology, Ink.
International Classes:
G06F12/0817; G06F12/1072; G11C5/04
Domestic Patent References:
JP2005234854A
JP2007199999A
JP2012514286A
JP2008046701A
JP2009116398A
Foreign References:
US20050198441
US20070174557
US20100165692
WO2014178854A1
US20130347110
US20120106228
US20040088495
WO2012077169A1
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Yoshiyuki Osuga
Nomura Yasuhisa