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Title:
切粉処理装置
Document Type and Number:
Japanese Patent JP6955895
Kind Code:
B2
Abstract:
A swarf handling apparatus installed in a machining tool that performs machining operation accompanied with production of stringy swarf includes a swarf catching device. The swarf catching device includes a holder unit that holds the stringy swarf when the stringy swarf makes contact with the holder unit. The swarf catching device causes the holder unit to be floated in a region around a machining point in such a manner that the position of the holder unit is varied relative to the machining point, for catching the stringy swarf in the holder unit.

Inventors:
Hiroyuki Sugiura
Application Number:
JP2017088831A
Publication Date:
October 27, 2021
Filing Date:
April 27, 2017
Export Citation:
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Assignee:
Okuma Corporation
International Classes:
B23Q11/00; B23B25/00; B23B47/34; B23G1/44
Domestic Patent References:
JP7009224A
JP59191234U
JP2016124054A
JP53051681U
JP7276179A
JP7025008B2
JP5305548A
JP60167706A
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office



 
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