Title:
ウェハにガラス粉末を充填する装置
Document Type and Number:
Japanese Patent JP7300539
Kind Code:
B2
Abstract:
The present disclosure pertains to the technical field of electronic component production equipment, and provides an apparatus for filling a wafer with glass powder. The apparatus for filling a wafer with glass powder includes a supporting device for supporting a wafer, a feeding device (5) and a scraping device (6), where the feeding device (5) and the scraping device (6) are both provided on an upper side of the supporting device; a lower side of the feeding device (5) is provided with a fetching part, and the feeding device (5) drives the fetching part to move; a lower side of the scraping device (6) is provided with a scraper (43), and the scraping device (6) drives the scraper (43) to move. After the feeding device evenly applies the glass powder to the wafer through the fetching part, the scraping device removes an excess of the glass powder on the wafer through the scraper to ensure an appropriate amount of glass powder on the wafer, avoiding complex subsequent processing due to excessive glass powder, and avoiding uneven glass powder distribution. The present disclosure achieves fast and stable glass powder application, which improves the yield of the electronic component and reduces the production cost.
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Inventors:
Lee Chandon
Application Number:
JP2022080381A
Publication Date:
June 29, 2023
Filing Date:
May 16, 2022
Export Citation:
Assignee:
Chandon Tsaiju Electronic Technology Company Limited
International Classes:
B05C1/02; B05C11/10; B05C19/00; H01L21/316
Domestic Patent References:
| JP55006805A | ||||
| JP2006150233A |
Foreign References:
| WO2018101031A1 |
Attorney, Agent or Firm:
Sachiko Takeda