Title:
サブマウント
Document Type and Number:
Japanese Patent JP7324665
Kind Code:
B2
Abstract:
To provide a submount that can stabilize a composition of a solder film and stably generate a eutectic structure of the solder film.SOLUTION: A submount 10 for placing electronic components on a support substrate includes a substrate 11, a first metal film 12b formed on at least one side of the substrate 11, and a solder film 14b formed on the first metal film 12b. On the side surface of the first metal film 12b, there is a second metal film 15a with a surface that has better wettability for the solder film 14b than that of the first metal film 12b.SELECTED DRAWING: Figure 1
Inventors:
Mitsunori Miyamoto
Toshihide Sekine
Takatoshi Kiuchi
Toshihide Sekine
Takatoshi Kiuchi
Application Number:
JP2019166870A
Publication Date:
August 10, 2023
Filing Date:
September 13, 2019
Export Citation:
Assignee:
Citizen Fine Device Co., Ltd.
International Classes:
H01S5/023; C23C28/02; H01L23/12; H01L23/36
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Foreign References:
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