Title:
ダイボンディング装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7328848
Kind Code:
B2
Abstract:
To provide a technique capable of reducing an installation area.SOLUTION: A die bonding device comprises: a first conveyance lane conveying a substrate; a second conveyance lane provided to a vertical direction to the first conveyance lane spaced with a predetermined distance and conveying the substrate; and a first bonding part provided at a position of the first conveyance lane and mounting a die to the substrate; a second bonding part provided at a position of the first conveyance lane on a downstream of the first bonding part and mounting the die to the substrate; a first elevator part provided to an upstream of the first bonding part and moving the substrate forward and rearward between the first conveyance lane and the second conveyance lane; and a second elevator part provided between the first bonding part and the second bonding part and moving the substrate forward and rearward between the first conveyance lane and the second conveyance lane.SELECTED DRAWING: Figure 3
Inventors:
Takashi Yamagami
Application Number:
JP2019171820A
Publication Date:
August 17, 2023
Filing Date:
September 20, 2019
Export Citation:
Assignee:
Fasford Technology Co., Ltd.
International Classes:
H01L21/52
Domestic Patent References:
| JP2002246793A | ||||
| JP2003142882A | ||||
| JP2012038755A | ||||
| JP2019160948A | ||||
| JP2008210824A |
Attorney, Agent or Firm:
Polaire Patent Attorneys Corporation
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