Title:
加工方法及び加工装置
Document Type and Number:
Japanese Patent JP7369645
Kind Code:
B2
Abstract:
To improve flatness of a substrate that is processed by a processing device whose inner temperature is out of a desired processing temperature.SOLUTION: A processing method, in which a substrate is processed by a processing device whose inner temperature is out of a desired processing temperature, includes steps of: measuring the inner temperature of the processing device; adjusting relative inclinations of a holding part that holds the substrate and a grinding part that grinds the substrate based on the measured inner temperature; and grinding the substrate while holding the substrate with the adjusted inclinations. The inclinations are determined based on a correlation between the inner temperature of the processing device obtained in advance and a finished-thickness distribution of the substrate.SELECTED DRAWING: Figure 3
Inventors:
Nobutaka Fukunaga
Kazuya Ikegami
Kazuya Ikegami
Application Number:
JP2020035306A
Publication Date:
October 26, 2023
Filing Date:
March 02, 2020
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B47/22; B24B7/04; B24B49/14; H01L21/304
Domestic Patent References:
| JP2017104952A | ||||
| JP2011136398A | ||||
| JP2010029973A | ||||
| JP11188621A | ||||
| JP2274459A | ||||
| JP3104545A | ||||
| JP2019093517A |
Foreign References:
| US6872662 |
Attorney, Agent or Firm:
Tetsuo Kanemoto
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine