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Title:
加工処理装置
Document Type and Number:
Japanese Patent JP7407391
Kind Code:
B2
Abstract:
To provide a processing apparatus having a simple structure and capable of reducing manufacturing cost.SOLUTION: A processing apparatus of this invention includes: a processing part for processing a sheet along a width direction orthogonal to a conveying direction F of the sheet; and a receiving part for receiving a first processing tool removably to an apparatus body. The first processing tool is provided with a first processing part extending along the width direction, and a second processing tool extends along the width direction, and is provided with second processing parts that engages with the first processing part to perform the processing. The plurality of second processing parts are provided side by side in the conveyance direction F, and the plurality of second processing parts include an upstream processing part 77 provided on the upstream side of the conveyance direction and a downstream processing part 78 provided on the downstream side of the upstream processing part. The receiving part receives the first processing tool at both an upstream mounting position U capable of being engaged with the upstream processing part and a downstream mounting position D capable of being engaged with the downstream processing part.SELECTED DRAWING: Figure 5

Inventors:
Kenta Takimoto
Taichi Yamaguchi
Kohei Ohkochi
Application Number:
JP2019173814A
Publication Date:
January 04, 2024
Filing Date:
September 25, 2019
Export Citation:
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Assignee:
Dupro Seiko Co., Ltd.
International Classes:
B31B50/00
Domestic Patent References:
JP2015047654A
JP58104739A
JP2017209773A
JP2018196964A
JP2010142988A
JP236093A
Foreign References:
US6481318
KR2020080006423U
Attorney, Agent or Firm:
Kaori Higashiyama