Title:
半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7412555
Kind Code:
B2
Abstract:
The present invention provides: an adhesive sheet which sufficiently and stably adheres to the back surface of a lead frame and the back surface of a sealing resin, and is not separated therefrom before a separation step even if subjected to a thermal history associated with QFN assembly, and which is free from leakage of the sealing resin, while being able to be easily separated in the separation step without the occurrence of adhesive residue, namely without leaving some adhesive behind, or without the occurrence of breakage; and a method for producing a semiconductor device, said method using this adhesive sheet. An adhesive sheet for semiconductor device production according to the present invention comprises a base material and a thermosetting adhesive layer that is provided on one surface of the base material; and this adhesive sheet for semiconductor device production is bonded to a lead frame or a wiring board of a semiconductor device in a removable manner. The adhesive layer of this adhesive sheet contains (a) a carboxyl group-containing acrylonitrile-butadiene copolymer, (b) an epoxy resin having a structural formula (1), (c) a compound containing two or more maleimide groups, and (d) a latent curing agent.
Inventors:
Daisuke Mizutani
Yasushi Kondo
Attached Fumiho
Yasushi Kondo
Attached Fumiho
Application Number:
JP2022526934A
Publication Date:
January 12, 2024
Filing Date:
May 19, 2021
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
H01L21/56; C09J7/35; C09J109/02; C09J163/00; H01L23/50
Domestic Patent References:
| JP2017171814A |
Foreign References:
| WO2019156253A1 |
Attorney, Agent or Firm:
Shu Oikawa
Makiko Otsuki
Emi Hattori
Junichi Kobayashi
Makiko Otsuki
Emi Hattori
Junichi Kobayashi