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Patent Searching and Data


Title:
多層構造体及び包装体
Document Type and Number:
Japanese Patent JP7415232
Kind Code:
B2
Abstract:
The present invention relates to a multilayer structure used in a treatment under a high pressure of 100 MPa or more including, an ethyl ene-vinyl alcohol-based copolymer layer, a heat sealing resin layer, and an adhesive resin layer, in which the ethylene-vinyl alcohol-based copolymer layer contains a sodium ion, and a content of the sodium ion in the ethylene-vinyl alcohol-based copolymer layer is 10 ppm to 500 ppm.

Inventors:
Shinji Nakanishi
Application Number:
JP2021509473A
Publication Date:
January 17, 2024
Filing Date:
March 24, 2020
Export Citation:
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Assignee:
Mitsubishi Chemical Corporation
International Classes:
B32B27/28; B32B27/00; B32B27/18; B65D65/40
Domestic Patent References:
JP9150453A
JP2018058298A
Foreign References:
WO2003072653A1
Attorney, Agent or Firm:
Patent Attorney Corporation Eiko Office