Title:
実装装置及び実装装置における平行度検出方法
Document Type and Number:
Japanese Patent JP7417340
Kind Code:
B2
Abstract:
In this method for detecting a degree of parallelism of a mounting device (100): a triangular pin (41) is arranged at a point A on a placement surface (12) of a stage (10); a mounting head (20) is lowered, and a height of the mounting head (20) when a holding surface (23) comes into contact with a tip end (42) of the triangular pin (41) is detected using an encoder (25), after which the triangular pin (41) is moved to a point B and the mounting head (20) is lowered; the height of the mounting head (20) when the holding surface (23) comes into contact with the tip end (42) of the triangular pin (41) is detected by the encoder (25); and the degree of parallelism between the placement surface (12) of the stage (10) and the holding surface (23) of the mounting head (20) is calculated on the basis of the detected heights at point A and point B.
More Like This:
| WO/2019/030876 | COMPONENT ALLOCATION DEVICE |
| WO/2024/057433 | COMPONENT MOUNTER AND COMPONENT IMAGING METHOD |
| JPH068512 | [Name of invention] Contact pin automatic holding force check device |
Inventors:
Yuichiro Noguchi
Application Number:
JP2023500479A
Publication Date:
January 18, 2024
Filing Date:
February 22, 2021
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H05K13/08; H01L21/52; H01L21/60
Domestic Patent References:
| JP9232798A | ||||
| JP2014017328A |
Foreign References:
| WO2016024364A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation YKI International Patent Office