Title:
フィラー及びその生成方法、高周波信号伝送用電解銅箔の製造方法
Document Type and Number:
Japanese Patent JP7436997
Kind Code:
B2
Abstract:
A method for preparing a filling material includes: dissolving FeCl3·6H2O and an imprinted molecule in water to form a reaction solution; adding DMF to the reaction solution and stirring for dissolution; adding BDC to the reaction solution and stirring for dissolution; soaking PC into the reaction solution and stirring; and treating the reaction solution by a hydrothermal method to remove a molecule of an additive decomposition product and prepare the filling material imprinted with a casting structure of the molecule of additive decomposition product. The present invention can effectively and selectively adsorb the additive decomposition products and achieve the effects of effectively removing the additive decomposition products, preventing the decomposition products from being mixed in an electrodeposition film of the copper, realizing the uniform distribution of current on the cathode and the anode, improving the quality and preparing an electrolytic copper foil for high-frequency signal transmission.
Inventors:
Chen Zhi Building
Zeng Qianqing
Wang Wenchang
Wu Min Hyun
Ming Xiao Qiang
Wang Hokyo
Zeng Qianqing
Wang Wenchang
Wu Min Hyun
Ming Xiao Qiang
Wang Hokyo
Application Number:
JP2022554789A
Publication Date:
February 22, 2024
Filing Date:
May 18, 2022
Export Citation:
Assignee:
Jiangsu Mingfeng Electronic Materials Technology Co., Ltd.
Changzhou University
Changzhou University
International Classes:
C25D1/04; C25B3/01; C25B3/23; C25B9/00; C25D21/18
Domestic Patent References:
| JP2001329390A | ||||
| JP2001295090A |
Foreign References:
| WO2021007987A1 | ||||
| WO2008030179A1 | ||||
| CN110479220A | ||||
| CN109402678A |
Attorney, Agent or Firm:
▲吉▼川 俊雄
Hiroshi Ichikawa
Hiroshi Ichikawa