Title:
インソール製造方法
Document Type and Number:
Japanese Patent JP7444558
Kind Code:
B2
Abstract:
A method of manufacturing an insole may include providing an electronic element on a support layer; connecting a connector to the support layer; providing the support layer to a lower mold frame; covering the lower mold frame with an upper mold frame; and applying a foam material between the lower mold frame and the upper mold frame.
Inventors:
Roh Shikun
安 惠▲うく▼
Changhyun Roh
朴 美▲きょん▼
▲ぺ▼ 藝智
Yongsuke Shen
Choi Min-ho
Byeong-hyun Choi
安 惠▲うく▼
Changhyun Roh
朴 美▲きょん▼
▲ぺ▼ 藝智
Yongsuke Shen
Choi Min-ho
Byeong-hyun Choi
Application Number:
JP2019142155A
Publication Date:
March 06, 2024
Filing Date:
August 01, 2019
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
A43B13/14; A43B3/34
Domestic Patent References:
| JP2016515873A | ||||
| JP2014505574A | ||||
| JP2020532370A |
Foreign References:
| US20180168283 | ||||
| DE102014115135A1 | ||||
| US20180199656 | ||||
| US3505436 | ||||
| US20170265582 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Ohnuki
Tadahiko Ito
Shinsuke Ohnuki