基板ブレイク装置および基板ブレイク方法

Title:

基板ブレイク装置および基板ブレイク方法

Document Type and Number:

Japanese Patent JP7448970

Kind Code:

B2

Abstract:

To provide a substrate breaking device, though being the one adopting breaking free from a risk that chippings are generated at a parting end face and utilizing heat stress, capable of efficiently applying heat stress to a scribe line without spraying a heat medium to perform breaking. A substrate breaking device comprises: a substrate support body 1 mounting a substrate W worked with a scribe line S; and a breaking bar 4 to be contacted with the scribe line S of the substrate W. In a contact face between the breaking bar 4 and the substrate W, plural heat regions H set to a first temperature T1 and plural cold regions L set to a second temperature T2 lower than the first temperature are arranged side by side so as to be mutually adjacent, and heat stress is applied in such a manner that the heat regions H and the cold regions L are simultaneously brought into a surface contact along the scribing line S.

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Inventors:

Kazunori Nishida
Atsushi Tabata
Katsunori Ichikawa
Katsuki Nakata

Application Number:

JP2021205955A

Publication Date:

March 13, 2024

Filing Date:

December 20, 2021

Export Citation:

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