Title:
硬化性樹脂組成物、及び硬化体
Document Type and Number:
Japanese Patent JP7453905
Kind Code:
B2
Abstract:
A curable resin composition according to the present invention is a curable resin composition containing a moisture-curable resin (A). A cured product of the curable resin composition has a storage elastic modulus of 5 MPa or less at an elongation percentage of 25%, and a decrease rate of a tensile storage elastic modulus of the cured product of the curable resin composition is 15% or less, the tensile storage elastic modulus being measured in a temperature range of 50 to 100°C by a dynamic viscoelasticity measuring apparatus before and after the cured product is subjected to a heat treatment at 140°C for 24 hours.
Inventors:
Xu Kun
Akira Yuki
Takumi Kida
Tomokazu Tamagawa
Kohei Hagiwara
Akira Yuki
Takumi Kida
Tomokazu Tamagawa
Kohei Hagiwara
Application Number:
JP2020506376A
Publication Date:
March 21, 2024
Filing Date:
January 16, 2020
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C09J175/06; C08F2/44; C08F2/50; C08G18/10; C08G18/30; C08G18/44; C08G18/73; C08G18/76; C09J4/06; C09J11/06
Domestic Patent References:
| JP2003313531A | ||||
| JP2014122299A | ||||
| JP2015120323A | ||||
| JP2003327647A | ||||
| JP2020002261A |
Foreign References:
| WO2015190499A1 |
Attorney, Agent or Firm:
Masahiro Taguchi
Shigeo Torayama
Shigeo Torayama