Title:
高純度電気銅板
Document Type and Number:
Japanese Patent JP7454329
Kind Code:
B2
Abstract:
To provide a high-purity electrolytic copper containing Cu having purity of 99.9999 mass% or more excluding gas components, and 0.1 mass ppm or less of S, which can stably be produced when performing electrocrystallization by lowering electrodeposition stress and exhibit excellent handleability by suppressing the occurrence of warpage even after being separated from a cathode plate.SOLUTION: The purity of Cu excluding gas components (O, F, S, C and Cl) is 99.9999 mass% or higher containing 0.1 mass ppm or more of S and, the area ratio of a crystal having a plane orientation of (101) ±10° is less than 40% when measuring the crystal orientation on a cross section along the thickness direction by using electron backscattering diffraction.SELECTED DRAWING: None
More Like This:
Inventors:
Keiei Tarutani
Kenji Kubota
Kiyotaka Nakaya
Ko Arai
Kenji Kubota
Kiyotaka Nakaya
Ko Arai
Application Number:
JP2018097319A
Publication Date:
March 22, 2024
Filing Date:
May 21, 2018
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
C25C1/12; C22B15/14; C22C9/00
Domestic Patent References:
| JP2005533187A | ||||
| JP4232088B2 | ||||
| JP2017066514A |
Foreign References:
| WO2017033694A1 | ||||
| US20170088963 |
Other References:
中野博昭他、「電解精製浴からの電析銅の表面形態および結晶組織に及ぼす添加剤の相乗効果」、Journal of MMIJ、2011年09月25日、Vol.127、No.10_11、pp.662-666
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori