Title:
端子及び放熱構造
Document Type and Number:
Japanese Patent JP7457599
Kind Code:
B2
Abstract:
To provide a terminal and heat dissipation structure, capable of guiding, to a heat conduction member, the heat generated at an electrically connected connection part with higher efficiency than the usual for heat dissipation from the heat conduction member.SOLUTION: A female connection part 12 integrally includes: a second electric wire caulking part 12b for caulking a first electric wire 11; a cylindrical part 12c connected with a male connection part 22 fitted on a second electric wire 21; and a heat conduction member caulking part 12d for caulking a heat conduction member 30 which conducts the heat generated at the cylindrical part 12c by electrical connection of the male connection part 22 and the cylindrical part 12c or the heat transmitted from the second electric wire 21 to the cylindrical part 12c for heat dissipation.SELECTED DRAWING: Figure 1
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Inventors:
Takahiro Shoda
Application Number:
JP2020132434A
Publication Date:
March 28, 2024
Filing Date:
August 04, 2020
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H01R4/18; H01R13/46
Domestic Patent References:
| JP7220787A |
Attorney, Agent or Firm:
Nobuo Nakamura
Shoichi Masuto
Shoichi Masuto