Title:
感光性樹脂組成物、エッチング方法及び樹脂構造体の製造方法
Document Type and Number:
Japanese Patent JP7457649
Kind Code:
B2
Abstract:
The present invention addresses the problem of providing: a photosensitive resin composition which has excellent resistance to a strong alkaline etching liquid that contains 15-45% by mass of an alkali metal hydroxide and 5-40% by mass of an ethanolamine compound; and an etching method which uses this photosensitive resin composition. The present invention solves the above-described problem by means of: a photosensitive resin composition which contains at least (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) a polymerizable monomer, and which is configured such that 5-80% by mass of a compound represented by general formula (i), wherein (m + n) is from 2 to 7 (inclusive), is contained as the polymerizable monomer (C), or which is alternatively configured such that the alkali-soluble resin (A) is a copolymer of styrene and a methacrylic acid, and a compound represented by general formula (i), wherein (m + n) is from 2 to 20 (inclusive), is contained as the polymerizable monomer (C), with the content of a compound wherein (m + n) is from 2 to 7 (inclusive) being 80% by mass or less; and an etching method and a method for producing a resin structure, each of which uses this photosensitive resin composition.
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Inventors:
Munetoshi Irisawa
Akira Ito
Masahiro Tanabe
Yuji Toyoda
Kunihito Kajitani
Akira Ito
Masahiro Tanabe
Yuji Toyoda
Kunihito Kajitani
Application Number:
JP2020530160A
Publication Date:
March 28, 2024
Filing Date:
July 08, 2019
Export Citation:
Assignee:
Mitsubishi Paper Mills Co., Ltd.
International Classes:
G03F7/027; C08F2/44; C08F20/10; C08F265/06; G03F7/033; G03F7/20; G03F7/40
Domestic Patent References:
| JP2006053352A | ||||
| JP2007008969A |
Foreign References:
| WO2017159873A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Takahashi International Patent Office