Title:
基板テスト装置およびそれを用いるデチャック力の測定方法
Document Type and Number:
Japanese Patent JP7457765
Kind Code:
B2
Abstract:
A substrate test apparatus is provided that can measure a dechucking force with high reliability. The substrate test apparatus includes an electrostatic chuck, a normal-force measuring unit disposed on the electrostatic chuck to be capable of pushing or pulling the substrate vertically, an electrostatic-chuck power supplying unit for applying a driving voltage and a first ground voltage to the electrostatic chuck, and a substrate power supplying unit for applying a second ground voltage to the substrate, wherein the substrate test apparatus performs steps including applying the driving voltage to the electrostatic chuck and charging the substrate by applying the second ground voltage to the substrate, subsequently discharging the substrate by applying the first ground voltage to the electrostatic chuck and by applying the second ground voltage to the substrate, and subsequently measuring a dechucking force of the substrate by pulling the substrate vertically by the normal-force measuring unit.
Inventors:
Kim, Jin Ho
i, do hee
Ryu, He Yeon
i, do hee
Ryu, He Yeon
Application Number:
JP2022146787A
Publication Date:
March 28, 2024
Filing Date:
September 15, 2022
Export Citation:
Assignee:
SEMES CO., LTD.
International Classes:
H01L21/683
Domestic Patent References:
| JP2005012144A | ||||
| JP10247675A | ||||
| JP2010272709A | ||||
| JP2010258452A | ||||
| JP2000234973A |
Foreign References:
| WO2006049085A1 | ||||
| WO2020054682A1 |
Attorney, Agent or Firm:
IBC Ichibancho Patent Attorney Corporation