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Title:
半導体レーザモジュール
Document Type and Number:
Japanese Patent JP7461870
Kind Code:
B2
Abstract:
A semiconductor laser module that can increase output of an optical fiber laser is provided. The semiconductor laser module includes: a mounted-base member having a mounted-base face; a plurality of semiconductor laser elements installed on the mounted-base face of the mounted-base member; a lens that collimates laser light emitted from the semiconductor laser element; a condensing lens that condenses the laser light; and an optical fiber to which the condensed laser light is optically coupled, and further includes: between the condensing lens that condenses the laser light and the lens that collimates laser light emitted from the semiconductor laser element, an aperture that restricts light in a slow axis direction of the laser light.

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Inventors:
Yuta Ishige
Etsuji Katayama
Application Number:
JP2020500555A
Publication Date:
April 04, 2024
Filing Date:
February 14, 2019
Export Citation:
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Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01S5/02251; G02B6/42; H01S3/067; H01S3/0941
Domestic Patent References:
JP2015126036A
JP2005150451A
JP10325933A
Foreign References:
US20070291813
WO2015037725A1
WO2017022142A1
Attorney, Agent or Firm:
Okabe
Koji Yoshizawa