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Title:
半導体製造プロセスの条件を決定するための方法およびコンピュータプログラム
Document Type and Number:
Japanese Patent JP7465912
Kind Code:
B2
Abstract:
A method for determining one or more optimized values of an operational parameter of a sensor system configured for measuring a property of a substrate is disclosed the method comprising: determininga quality parameter for a plurality of substrates; determining measurement parameters for the plurality of substrates obtained using the sensor system for a plurality of values of the operational parameter; comparing a substrate to substrate variation of the quality parameter and a substrate to substrate variation of a mapping of the measurement parameters; and determining the one or more optimized values of the operational parameter based on the comparing.

Inventors:
Tinnemans, Patriceus, Aloysius, Jacobs
Full Sebos, Ed, Maria
Mahens, Henriks, Johannes, Lambertos
Elda Mar, Armet, Korey
Felhaes, Roke, Johannes, Petrus
Lorovs, Willem, Thegn, Christianu
Van de Fenn, Wendy, Johanna, Martina
Yagbizade, Hadi
Secret, Hakki, Ergun
Brinkhoff, Ralph
Vu, Trang, Tan, Tui
Goosen, Michael, Roberto
Fun Tee Westeinde, Maike
Ko, Waitian
Rapestra, Manauk
Cox, Matteis
Bunen, Franciscus, Godefridus, Casper
Application Number:
JP2022109683A
Publication Date:
April 11, 2024
Filing Date:
July 07, 2022
Export Citation:
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Assignee:
ASM L Netherlands B.V.
International Classes:
G03F9/00; G01B11/00
Domestic Patent References:
JP2005513771A
JP2011066323A
JP10022207A
JP2013118369A
Foreign References:
WO2017032534A2
Attorney, Agent or Firm:
Kenki Morishita
Takeshi Aoki