Title:
樹脂組成物、成形体、電子部品、及び電子機器
Document Type and Number:
Japanese Patent JP7470301
Kind Code:
B2
Abstract:
To provide a resin composition excellent in all of cost, mechanical strength, and flame retardancy.SOLUTION: The resin composition contains a PC resin, a PS resin, an ABS resin, and phosphorus-based compounds. The resin composition contains 45 pts.mass or more and less than 70 pts.mass of the PC resin based on 100 pts.mass of the total of the resins, 70 pts.mass or more and 85 pts.mass or less in total of the PC resin and the ABS resin based on 100 pts.mass of the total of the resins, and 15 pts.mass or more and 30 pts.mass or less of the PS resin based on 100 pts.mass of the total of the resins. At least one of the phosphorus-based compounds is a phosphazene-based compound. The resin composition contains 0.1 pt.mass or more and 4.0 pts.mass or less of the phosphazene-based compound based on 100 pts.mass of the total of the resins.SELECTED DRAWING: None
Inventors:
Yoshitaka Sekiguchi
Mitsuyo Matsumoto
Natsuki Koike
Akira Suzuki
Mitsuyo Matsumoto
Natsuki Koike
Akira Suzuki
Application Number:
JP2020068542A
Publication Date:
April 18, 2024
Filing Date:
April 06, 2020
Export Citation:
Assignee:
株式会社リコー
International Classes:
C08L69/00; C08K3/32; C08K5/521; C08K5/5399; C08L25/06; C08L55/02
Domestic Patent References:
| JP2016003290A | ||||
| JP2019119887A | ||||
| JP8165392A | ||||
| JP2009137942A | ||||
| JP2001123058A |
Attorney, Agent or Firm:
Masami Sakai