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Document Type and Number:
Japanese Patent JPH0119324
Kind Code:
B2
Abstract:
Crystalline rods or blocks can be sawed into thin wafers by sawing the rod or block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed with a two-blade internal-hole saw.

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Inventors:
GYUNTAA RETSUSURU
HERUMUUTO TSUAUHAARU
HORUSUTO SHUTOTSUKU
Application Number:
JP6463683A
Publication Date:
April 11, 1989
Filing Date:
April 14, 1983
Export Citation:
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Assignee:
WATSUKAA HIEMITOROONITSUKU G FUYUURU EREKUTOROONIKU GURUNTOSHUTOTSUFUE MBH
International Classes:
B23D59/00; B24B27/06; B28D5/00; B28D5/02; B28D5/04



 
Next Patent: JPH0119325